In this new year, we have reported many news about GaN, SiC, and all the innovations of electric vehicles and power systems. Next year, in 2021, interesting new solutions will be awaiting, as we have reported in: What’s next in power electronics 2021? Power Management, GaN/SiC and T&M.

Here you will find a list of the top10 news that received the most feedbacks

1. ROHM Group Company SiCrystal and ST announce SiC wafer supply agreement

ROHM announced it signed a multi-year silicon carbide (SiC) wafers supply agreement with SiCrystal, a ROHM group company having a top share of SiC wafers in Europe.

2. Nexperia: low RDS(on) MOSFET in LFPAK56

Nexperia announced the release of its lowest-ever RDS(on) power MOSFET. Already recognised as the industry-leader in low voltage, low RDS(on) devices, the PSMNR51-25YLH launched today sets a new standard of 0.57 mΩ at 25 V

3. UnitedSiC launches lowest RDS(on) FETs in DFN 8×8 format

UnitedSiC has introduced the UF3SC065030D8 and UF3SC065040D8; the industry’s lowest RDS(on) SiC FETs available in the popular low-profile DFN 8×8 surface-mount package.

4. Infineon: 400 kW DC charger based on CoolSiC for ultra-fast pit stops

Ingeteam and Infineon Technologies team up for best customer experience in superfast electric vehicle (EV) charging. Rated at 400 kW, the converter INGEREV® RAPID ST400 from Ingeteam is based on CoolSiC™ MOSFETs in an EasyDUAL™ 2B housing.

5. SiC power module and programmable gate driver kit for inverter design

Microchip Technology announced its AgileSwitch digital programmable gate driver and SP6LI SiC power module kit, a unified system solution to help designers quickly and effectively adopt disruptive Silicon Carbide (SiC) power devices – reducing time to market and ensuring confidence in field deployment.

6. EPC Space: space level qualified 40 to 300 V Rad Hard eGaN power transistors

EPC Space announced a family of Rad Hard enhancement mode power transistors spanning a range of 40 Volts to 300 Volts, and 4 Amperes to 30 Amperes.

7. New MinE-CAP IC Reduces Volume of AC-DC Converters by Up to 40%

Power Integrations has announced the MinE-CAP™ IC for high power density, universal input AC-DC converters. By halving the size of the high-voltage bulk electrolytic capacitors required in offline power supplies, this new type of IC enables a reduction in adapter size of up to 40%.

8. Industry’s first automotive GaN FET with integrated driver, protection and active power management

Texas Instruments has expanded its high-voltage power management portfolio with the next generation of 650-V and 600-V gallium nitride (GaN) field-effect transistors (FETs) for automotive and industrial applications.

9. New Gen V GaN

Transphorm Inc. has announced  the sampling of its first Gen V device under its proprietary SuperGaNTM brand. The TP65H015G5WS, Transphorm’s new Gen V device, targets the Electric Vehicle (EV) market and provides industry-leading performance enhancements, ease of designability, and optimized cost structure that is inherent to the SuperGaN device family.

10. Non-Conductive, High Thermal Die Attach Paste with Automotive Grade Reliability

Expanding its line of automotive grade die attach materials for advanced semiconductor packages, Henkel has developed and commercialized LOCTITE ABLESTIK ABP 8920TC.

News source: https://www.powerelectronicsnews.com/top-10-news-of-2020/